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Singular Boundary Method for Heat Conduction in Layered Materials
http://hdl.handle.net/20.500.12678/0000007219
http://hdl.handle.net/20.500.12678/0000007219d29a3534-42d9-49a9-acab-3dea3926fd7d
488ed700-f49d-4f47-80ad-2bddc1a09488
Name / File | License | Actions |
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Singular Boundary Method for Heat Conduction in Layered Materials, Htike Htike.pdf (1.1 MB)
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Copyright © 2011 Tech Science Press
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Publication type | ||||||
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Journal article | ||||||
Upload type | ||||||
Publication | ||||||
Title | ||||||
Title | Singular Boundary Method for Heat Conduction in Layered Materials | |||||
Language | en | |||||
Authors | ||||||
Htike Htike | ||||||
W. Chen | ||||||
Y. Gu | ||||||
Description | ||||||
In this paper, we investigate the application of the singular boundary method (SBM) to two-dimensional problems of steady-state heat conduction in isotropic bimaterials. A domain decomposition technique is employed where the bimaterial is decomposed into two subdomains, and in each subdomain, the solution is approximated separately by an SBM-type expansion. The proposed method is tested and compared on several benchmark test problems, and its relative merits over the other boundary discretization methods, such as the method of fundamental solution (MFS) and the boundary element method (BEM), are also discussed. |
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Keywords | ||||||
Singular boundary method, origin intensity factor, heat conduction, bimaterials, meshless. | ||||||
Journal articles | ||||||
1 | ||||||
CMC: Computers, Materials, & Continua | ||||||
1-14 | ||||||
24, 2011 |