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Item / RELIABILITY AND MATERIAL CHARACTERIZATION OF SINTERED AG DIE ATTACH ON VARYING NITROGEN LEVELS FOR HIGH TEMPERATURE MICROELECTRONIC APPLICATIONS / Reliability and material characterization of sintered AG Die attach on varying Nitrogen levels for high temperature Microelectronic applications
Reliability and material characterization of sintered AG Die attach on varying Nitrogen levels for high temperature Microelectronic applications
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 Reliability and material characterization of sintered AG Die attach on varying Nitrogen levels for high temperature Microelectronic applications.pdf (1.4 MB)
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| Display File | Reliability and material characterization of sintered AG Die attach on varying Nitrogen levels for high temperature Microelectronic applications.pdf | |||||
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| Text URL | https://meral.edu.mm/record/2287/files/Reliability and material characterization of sintered AG Die attach on varying Nitrogen levels for high temperature Microelectronic applications.pdf | |||||
| Format | application/pdf | |||||
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| Size | 1415 Kb | |||||
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