MERAL Myanmar Education Research and Learning Portal
Item / RELIABILITY AND MATERIAL CHARACTERIZATION OF SINTERED AG DIE ATTACH ON VARYING NITROGEN LEVELS FOR HIGH TEMPERATURE MICROELECTRONIC APPLICATIONS / Reliability and material characterization of sintered AG Die attach on varying Nitrogen levels for high temperature Microelectronic applications
Reliability and material characterization of sintered AG Die attach on varying Nitrogen levels for high temperature Microelectronic applications
| File | License |
|---|---|
 Reliability and material characterization of sintered AG Die attach on varying Nitrogen levels for high temperature Microelectronic applications.pdf (1.4 MB)
sha256
d86a516b836e179e11621dc374443f98ab997099d2aeaee5c8f0af45ec1d26f9
|
| Version | Date Modified | Object File Name | File Size | File Hash Value | Contributor Name | Show/Hide |
|---|